Aqua, Paraffinum Liquidum, Propylene Glycol, Petrolatum, Aluminum Starch Octenylsuccinate, Caprylic/Capric Triglyceride, Cetearyl Alcohol, Glyceryl Stearate, Butyrospermum Parkii Butter, PEG-100 Stearate, Polysorbate 60, Disodium EDTA, Imidazolidinyl Urea, Methylparaben, Parfum, Propylparaben, Triethanolamine, Acrylates/C10-30 Alkyl Acrylate Crosspolymer, Xanthan Gum, Benzyl Salicylate, Citronellol, Linalool, Alpha-Isomethyl Ionone, Geraniol, Rosa Centifolia Flower Extract, Citric Acid
Benefits of Maleic Bond Repair Complex 05% Hair Serum
- Repair damaged hair: Our patent pending combination of maleic acid, transglutaminase, and amino acids effectively repairs damaged hair, restoring its strength and vitality.
- Strengthens hair: By repairing the bonds within the hair structure, our serum helps to strengthen your hair, making it more resistant to breakage and damage.
- Nourishes from the inside out: Formulated with argan oil, squalane, and coconut oil, our serum deeply nourishes your hair from the inside out, leaving it soft, shiny, and healthy.
Results of using Maleic Bond Repair Complex 05% Hair Serum
- Improved hair texture: Regular use of our serum will result in smoother and more manageable hair with improved texture.
- Reduced frizz: Say goodbye to frizzy hair! Our serum helps to tame frizz and flyaways for a sleek and polished look.
- Increase in hair strength: With continued use, you will notice a significant increase in the strength of your hair, reducing breakage and promoting overall hair health.
Elevate your hair care routine with our Maleic Bond Repair Complex 05% Hair Serum. This innovative pre-shampoo serum is specially formulated to repair damaged hair and make it strong. Our patent pending combination of maleic acid, transglutaminase, and amino acids effectively repairs the bonds within the hair structure, restoring its strength and vitality. Additionally, this serum is enriched with argan oil, squalane, and coconut oil to nourish your hair from the inside out, leaving it soft, shiny, and healthy.
